Generate a perfectly fitted, 3D-printable case for your Seeed Studio XIAO ESP32S3. Verified 21x17.8mm base dimensions with Above-board dominated by USB-C receptacle height (~3mm).
Compact ESP32 boards at 14-22mm footprint dissipate ~200-400mW in active mode. The small footprint limits thermal mass, but the duty cycle of typical IoT applications (sleep-dominated) keeps average dissipation low.
These boards are typically embedded in wearables, small gadgets, and quick prototypes — PLA is adequate for rapid iteration. PETG for products that see pocket wear or environmental exposure. ABS for integration into larger injection-molded-style assemblies.
PCB antenna on one short edge (opposite USB) — ≥8mm metal-free clearance. No metallic paint, carbon fill, or iron inserts within that zone.
USB-C is the only programming and power path — MUST remain accessible for firmware updates.
Castellated edge pads support surface-mount installation directly on a parent PCB — if using this mounting method, no enclosure mounting holes exist; parent-PCB mounting is load-bearing.
Tiny footprint makes strain relief critical — a USB-C cable can lever the board out of a solder joint if no mechanical support is provided.
Some variants have onboard LiPo charging circuitry — if battery is used, thermal behavior shifts; allow more below-board clearance for the cell.
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Mechanical properties are estimates. Validate critical loads before use.