Generate a perfectly fitted, 3D-printable case for your Raspberry Pi Foundation Raspberry Pi Compute Module 5. Verified 55x40mm base dimensions with Default clearance fallback.
Compute Module dissipates 5-10W through a thermal pad on the module underside; the carrier board typically has a central cutout or thermal via field. Enclosure must allow airflow or thermal conduction to ambient — sealed enclosure without a heatsink path will thermal-throttle.
The CM4/CM5 surface temperature under sustained load exceeds PLA's deflection point, and industrial deployments (the CM family's primary market) benefit from ABS's long-term dimensional stability. PETG is the accessible default; PC provides rigid mounting points for vibration-prone installations.
Compute Module has no native connectors — all ports live on the carrier board. Enclosure geometry must match the carrier, not the CM module footprint.
The module's high-density connectors (2x100-pin Hirose DF40) require precise carrier-board mating force; do NOT apply enclosure compression to the module body.
Thermal pad on CM underside requires conductive contact or direct airflow — some carriers route heat via via stitching through the PCB.
Industrial-temperature CM variants have wider thermal tolerance but still require active airflow above sustained 80% CPU utilization.
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Mechanical properties are estimates. Validate critical loads before use.