Generate a perfectly fitted, 3D-printable case for your Raspberry Pi Foundation Raspberry Pi 4 Model B. Verified 85x56mm base dimensions with Above-board is dominated by the 17-20mm stacked USB-A receptacle height plus the 15mm active cooler when fitted — 20mm provides minimal headroom; add 5-10mm more if any HAT is planned.
The BCM2711 SoC dissipates 3-8W depending on frequency governor. Sustained workloads push internal enclosure temperatures to 45-55°C even with the official active cooler; a sealed enclosure without airflow ports will thermal-throttle within minutes under load.
PETG is the default: its 70-80°C heat deflection temperature accommodates the 45-55°C sustained internal temperatures without creep, and it prints at accessible temperatures on most hobbyist printers. ABS and PC extend headroom for closed installations or high-ambient environments. PLA is intentionally omitted — its 55°C deflection temperature is marginal under sustained Pi workloads.
Ensure microSD slot remains accessible without disassembling the enclosure — boot medium replacement is a common service operation.
Active cooler fan (~15mm tall) requires direct airflow path; a sealed top face will starve it and induce thermal throttling.
2.4/5 GHz WiFi antenna requires ≥10mm metal-free clearance; avoid carbon-filled PETG or metallic paints within that zone.
4-pin PWM fan header sits directly under the SoC — fan cable strain relief should route toward the nearest wall to avoid blocking heatsink airflow.
HAT-compatible enclosures must provide a pass-through or removable top panel to access the 40-pin GPIO header.
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Mechanical properties are estimates. Validate critical loads before use.