Generate a perfectly fitted, 3D-printable case for your NVIDIA NVIDIA Jetson Orin Nano Developer Kit. Verified 100x79mm base dimensions with Integrated heatsink+fan stack is ~25-28mm tall; allow 30mm above board to provide fan intake clearance.
Orin Nano's Ampere GPU + ARM cores dissipate 7-15W depending on power mode (7W MAXN). Even with the included heatsink+fan combo, sealed enclosures accumulate heat rapidly; active airflow ports are required for sustained 15W operation.
The 15W sustained TDP pushes internal enclosure temperatures well past PLA's creep threshold. PETG is the accessible minimum. ABS offers stronger long-term dimensional stability for industrial deployments. PC handles the heaviest thermal loads and provides the rigidity desirable for the larger 100x79mm footprint.
Heatsink+fan stack must have unobstructed intake — top-mounted wall within 5mm of fan will choke airflow.
Optional M.2 2280 NVMe socket on underside extends total module thickness; verify below-board clearance if SSD is populated.
2x CSI-2 camera connectors on +z are flex-cable — route along the +z-facing wall, not across the heatsink.
DC barrel jack on -y edge is the primary power input; MUST remain accessible or solder a JST-VH pigtail for enclosed installations.
Jetson.GPIO 40-pin header partially obscured by heatsink — HAT support requires custom low-profile spacers.
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Mechanical properties are estimates. Validate critical loads before use.