Generate a perfectly fitted, 3D-printable case for your NVIDIA NVIDIA Jetson Nano Developer Kit B01. Verified 100x80mm base dimensions with The integrated passive heatsink dominates above-board clearance (~25mm from PCB to fin tip).
Jetson Nano's Tegra X1 SoC dissipates 5-10W under GPU load; the included heatsink is passively cooled but saturates quickly in sealed enclosures. Active airflow is required for sustained ML inference workloads.
PETG accommodates the 50-60°C internal temperatures under sustained GPU load. ABS extends thermal headroom and offers better acetone-weld assembly for larger chassis. PC is preferred for industrial or vibration-prone installations where the larger Nano footprint (100x79mm) benefits from rigid mounting.
Do NOT attempt to enclose the heatsink — it is part of the thermal design. Enclosure top face should expose the heatsink directly to ambient air, ideally with a fan overlay.
Camera CSI connectors on +z are flex-cable; route must not route past the heatsink.
4-pin fan header (5V PWM) supports an aftermarket fan; enclosure top face should accommodate a 40mm or 50mm fan mount.
USB-A stack is 17mm tall — above-board clearance must clear the taller of heatsink or USB stack.
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Mechanical properties are estimates. Validate critical loads before use.